LMH6552
- 1.5-GHz –3 dB Small Signal
Bandwidth at AV = 1 - 1.25-GHz –3 dB Large Signal
Bandwidth at AV = 1 - 800-MHz Bandwidth at AV = 4
- 450-MHz 0.1 dB Flatness
- 3800-V/µs Slew Rate
- 10-ns Settling Time to 0.1%
- –90 dB THD at 20 MHz
- –74 dB THD at 70 MHz
- 20-ns Enable/Shutdown Pin
- 5-V to 12-V Operation
The LMH6552 device is a high-performance, fully differential amplifier designed to provide the exceptional signal fidelity and wide large-signal bandwidth necessary for driving 8-bit to 14-bit high-speed data acquisition systems. Using TIs proprietary differential current mode input stage architecture, the LMH6552 allows operation at gains greater than unity without sacrificing response flatness, bandwidth, harmonic distortion, or output noise performance.
With external gain set resistors and integrated common mode feedback, the LMH6552 can be configured as either a differential input to differential output or single-ended input to differential output gain block. The LMH6552 can be AC- or DC-coupled at the input which makes it suitable for a wide range of applications, including communication systems and high-speed oscilloscope front ends. The performance of the LMH6552 driving an ADC14DS105 device is 86 dBc SFDR and 74 dBc SNR up to 40 MHz.
The LMH6552 is available in an 8-pin SOIC package as well as a space-saving, thermally enhanced 8-pin WSON package for higher performance.
技术文档
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
LMH6552SDEVAL — 用于 LMH6552 高速差动放大器的评估板
The LMH6552 evaluation board is designed to aid in the characterization of National Semiconductors high speed fully differential amplifiers in an 8-pin LLP package.
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模拟仿真程序
TINA-TI 安装需要大约 500MB。直接安装,如果想卸载也很容易。我们相信您肯定会爱不释手。
TINA 是德州仪器 (TI) 专有的 DesignSoft 产品。该免费版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需获取可用 TINA-TI 模型的完整列表,请参阅:SpiceRack - 完整列表
需要 HSpice (...)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
WSON (NGS) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点