TIDEP-0100

System level cost savings tactics are a focus of this board design. Key areas affecting fabrication costs are number of PCB layers and via drill size. The AM570x features a package with via channel arrays. These channels make it possible to build the PCB in only 6-layers while still achieving 100% signal breakout. The added room helps with signal breakout and routing while avoiding the need for smaller, costlier drill bits for the vias. Another added benefit of larger vias is improved via reliability and electrical performance. This reference design is based on the Texas Instruments Sitara™ AM570x System on Chip. The source documents provided represent a board design that’s been tested for stability and compliance in certain key areas. Those areas are DDR stability, HDMI performance, oscilloscope captures of the power sequencing, and a Power Design Network (PDN) Integrity Analysis.

特性