TPS65930

正在供货

集成电源管理 IC (PMIC),具有 3 个 DC/DC、4 个 LDO 以及音频编解码器和 USB HS 收发器

产品详情

Processor supplier Texas Instruments Processor name OMAP Regulated outputs (#) 7 Step-down DC/DC converter 3 Step-up DC/DC converter 0 LDO 4 Vin (min) (V) 2.7 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 3.15 Iout (max) (A) 1.2 Configurability Factory programmable Features Comm control, Power sequencing Rating Catalog Operating temperature range (°C) -40 to 85 Step-down DC/DC controller 0 Step-up DC/DC controller 0 Switching frequency (typ) (kHz) 3200 Product type Processor and FPGA
Processor supplier Texas Instruments Processor name OMAP Regulated outputs (#) 7 Step-down DC/DC converter 3 Step-up DC/DC converter 0 LDO 4 Vin (min) (V) 2.7 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 3.15 Iout (max) (A) 1.2 Configurability Factory programmable Features Comm control, Power sequencing Rating Catalog Operating temperature range (°C) -40 to 85 Step-down DC/DC controller 0 Step-up DC/DC controller 0 Switching frequency (typ) (kHz) 3200 Product type Processor and FPGA
NFBGA (ZCH) 139 100 mm² 10 x 10
  • Power:
    • Three Efficient Step-down Converters
    • Four External Linear LDOs for Clocks and Peripherals
    • SmartReflex Dynamic Voltage Management
  • Audio (TPS65930 Device Only):
    • Differential Input Main Microphones
    • Mono Auxiliary/FM Input
    • External Predrivers for Class D (Stereo)
    • TDM Interface
    • Automatic Level Control (ALC)
    • Digital and Analog Mixing
    • 16-Bit Linear Audio Stereo DAC (96, 48, 44.1, and 32 kHz and Derivatives)
    • 16-Bit Linear Audio Stereo ADC (48, 44.1, and 32 kHz and Derivatives)
    • Carkit
  • USB:
    • USB 2.0 On-the-Go (OTG)-Compliant HS Transceivers
    • 12-Bit Universal Transceiver Macro Interface ULPI
    • USB Power Supply (5-V Charge Pump for VBUS)
    • Consumer Electronics Association (CEA)-2011: OTG Transceiver Interface Specification
    • CEA-936A: Mini-USB Analog Carkit Specification
  • Additional Features:
    • LED Driver Circuit for Two External LEDs
    • Two External 10-Bit MADC Inputs
    • Real-Time Clock (RTC) and Retention Modules
    • HS I2C Serial Control
    • Thermal Shutdown and Hot-Die Detection
    • Keypad Interface (up to 6 × 6)
    • External Vibrator Control
    • 15 GPIOs
    • 0.65-mm Pitch, 139-Pin, 10-mm × 10-mm Package
  • Charger:
    • Backup Battery Charger
  • APPLICATIONS
    • Smart Phones
    • Tablets
    • Industrial
    • Handheld Systems

SmartReflex Is a trademark of Texas Instruments OMAP Is a trademark of Texas Instruments

  • Power:
    • Three Efficient Step-down Converters
    • Four External Linear LDOs for Clocks and Peripherals
    • SmartReflex Dynamic Voltage Management
  • Audio (TPS65930 Device Only):
    • Differential Input Main Microphones
    • Mono Auxiliary/FM Input
    • External Predrivers for Class D (Stereo)
    • TDM Interface
    • Automatic Level Control (ALC)
    • Digital and Analog Mixing
    • 16-Bit Linear Audio Stereo DAC (96, 48, 44.1, and 32 kHz and Derivatives)
    • 16-Bit Linear Audio Stereo ADC (48, 44.1, and 32 kHz and Derivatives)
    • Carkit
  • USB:
    • USB 2.0 On-the-Go (OTG)-Compliant HS Transceivers
    • 12-Bit Universal Transceiver Macro Interface ULPI
    • USB Power Supply (5-V Charge Pump for VBUS)
    • Consumer Electronics Association (CEA)-2011: OTG Transceiver Interface Specification
    • CEA-936A: Mini-USB Analog Carkit Specification
  • Additional Features:
    • LED Driver Circuit for Two External LEDs
    • Two External 10-Bit MADC Inputs
    • Real-Time Clock (RTC) and Retention Modules
    • HS I2C Serial Control
    • Thermal Shutdown and Hot-Die Detection
    • Keypad Interface (up to 6 × 6)
    • External Vibrator Control
    • 15 GPIOs
    • 0.65-mm Pitch, 139-Pin, 10-mm × 10-mm Package
  • Charger:
    • Backup Battery Charger
  • APPLICATIONS
    • Smart Phones
    • Tablets
    • Industrial
    • Handheld Systems

SmartReflex Is a trademark of Texas Instruments OMAP Is a trademark of Texas Instruments

The TPS65920 and TPS65930 devices are power-management ICs for OMAP and other mobile applications. The devices include power-management, a universal serial bus (USB) high-speed (HS) transceiver, light-emitting diode (LED) drivers, an analog-to-digital converter (ADC), a real-time clock (RTC), and an embedded power control (EPC). In addition, the TPS65930 includes a full audio codec with two digital-to-analog converters (DACs) and two ADCs to implement dual voice channels, and a stereo downlink channel that can play all standard audio sample rates through a multiple format inter-integrated sound (I2S)/time division multiplexing (TDM) interface.

These optimized devices supports the power and peripheral requirements of the OMAP application processors. The power portion of the devices contains three buck converters, two controllable by a dedicated SmartReflex class-3 interface, multiple low dropout (LDO) regulators, an EPC to manage the power sequencing requirements of OMAP, and an RTC and backup module. The RTC can be powered by a backup battery when the main supply is not present, and the devices include a coin-cell charger to recharge the backup battery as needed.

The USB module provides a HS 2.0 OTG transceiver suitable for direct connection to the OMAP UTMI+ low pin interface (ULPI), with an integrated charge pump and full support for the carkit CEA-936A specification. An ADC is provided for monitoring signals, such as supply voltage, entering the device, and two additional an external ADC inputs are input is provided for system use.

The devices provide driver circuitry to power two LED circuits that can illuminate a panel or provide user indicators. The drivers also provide pulse width modulation (PWM) circuits to control the illumination levels of the LEDs. A keypad interface implements a built-in scanning algorithm to decode hardware-based key presses and reduce software use, with multiple additional general-purpose input/output devices (GPIOs) that can be used as interrupts when configured as inputs.

The TPS65920 and TPS65930 devices are power-management ICs for OMAP and other mobile applications. The devices include power-management, a universal serial bus (USB) high-speed (HS) transceiver, light-emitting diode (LED) drivers, an analog-to-digital converter (ADC), a real-time clock (RTC), and an embedded power control (EPC). In addition, the TPS65930 includes a full audio codec with two digital-to-analog converters (DACs) and two ADCs to implement dual voice channels, and a stereo downlink channel that can play all standard audio sample rates through a multiple format inter-integrated sound (I2S)/time division multiplexing (TDM) interface.

These optimized devices supports the power and peripheral requirements of the OMAP application processors. The power portion of the devices contains three buck converters, two controllable by a dedicated SmartReflex class-3 interface, multiple low dropout (LDO) regulators, an EPC to manage the power sequencing requirements of OMAP, and an RTC and backup module. The RTC can be powered by a backup battery when the main supply is not present, and the devices include a coin-cell charger to recharge the backup battery as needed.

The USB module provides a HS 2.0 OTG transceiver suitable for direct connection to the OMAP UTMI+ low pin interface (ULPI), with an integrated charge pump and full support for the carkit CEA-936A specification. An ADC is provided for monitoring signals, such as supply voltage, entering the device, and two additional an external ADC inputs are input is provided for system use.

The devices provide driver circuitry to power two LED circuits that can illuminate a panel or provide user indicators. The drivers also provide pulse width modulation (PWM) circuits to control the illumination levels of the LEDs. A keypad interface implements a built-in scanning algorithm to decode hardware-based key presses and reduce software use, with multiple additional general-purpose input/output devices (GPIOs) that can be used as interrupts when configured as inputs.

下载 观看带字幕的视频 视频

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 12
类型 标题 下载最新的英语版本 日期
* 数据表 TPS65920 and TPS65930 Integrated Power Management/Audio Codec (TPS65930 Only) – Silicon Revision 1.2 数据表 (Rev. I) PDF | HTML 2015年 1月 27日
* 勘误表 TPS659x0 Silicon Errata (Rev. G) 2011年 4月 8日
选择指南 电源管理指南 2018 (Rev. K) 2018年 7月 31日
选择指南 电源管理指南 2018 (Rev. R) 2018年 6月 25日
用户指南 TPS65930/20 OMAP™ Power-Management and System Companion Device ES1.2 TRM (Rev. G) 2011年 12月 2日
应用手册 TPS65950/930/920/921 USB Eye Diagram Trimming 2010年 11月 19日
用户指南 Powering OMAP™3 With TPS65930/20: Design-In Guide User's Guide (Rev. B) 2009年 6月 18日
应用手册 TPS65920/30 Schematic Checklist 2009年 6月 4日
应用手册 TPS65950/30/20 32 KHz Oscillator Schematic and PCB Layout Guidelines 2008年 10月 8日
用户指南 TPS65930/20 Layout Guide 2008年 10月 2日
更多文献资料 TPS65930 Integrated Power Management/Audio CODEC (Rev. A) 2008年 5月 12日
应用手册 Configuring TPS65950/30/20 Backup State 2006年 10月 8日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

驱动程序或库

TWL4030SW-LINUX — 用于 TWL4030 的 Linux 驱动程序

The Linux driver supports the TWL4030 series of Integrated Power Management ICs. The Linux driver supports communication through the I2C bus and interfaces with various sub-systems.

 

Linux Mainline Status

Available in Linux Main line: Yes
Available through git.ti.com: N/A

Supported Devices:

  • twl4030
  • (...)
仿真模型

TPS65930 BSDL Models

SWCM003.ZIP (3 KB) - BSDL Model
仿真模型

TPS65930 IBIS Model (Rev. A)

SWCM004A.ZIP (427 KB) - IBIS Model
CAD/CAE 符号

TPS65930 Orcad Symbol

SWCC005.ZIP (4 KB)
CAD/CAE 符号

TPS65930 Power Module Cadence Board/Layout File

SWCC008.ZIP (466 KB)
光绘文件

TPS65930 EVM Daughter Card Gerber Files

SWCC007.ZIP (995 KB)
原理图

TPS65930 Daughter Card Schematic

SWCC006.ZIP (109 KB)
参考设计

TIDA-00408 — 面向楼宇自动化和医疗应用的压电式反馈电容触摸显示器参考设计

采用触摸反馈的 TIDA-00408 触摸显示屏参考设计展示了用于恒温器、自动化建立、工厂自动化、销售点和汽车应用的触摸技术。当用户与屏上用户界面进行交互时,触摸屏会提供触摸反馈。该参考设计包含一块 7” 电容式触摸显示屏、一个 DRV2667 Piezo 触摸驱动器和两个 Piezo 传动器。
设计指南: PDF
原理图: PDF
封装 引脚 CAD 符号、封装和 3D 模型
NFBGA (ZCH) 139 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。

支持和培训

视频