TPS40061
- Operating Input Voltage 10 V to 55 V
- Input Voltage Feed-Forward Compensation
- < 1% Internal 0.7-V Reference
- Programmable Fixed-Frequency, Up to 1-MHz
Voltage Mode Controller - Internal Gate Drive Outputs for High-Side P-Channel
and Synchronous N-Channel MOSFETs - 16-Pin PowerPAD Package (θJC = 2°C/W)
- Thermal Shutdown
- Externally Synchronizable
- Programmable High-Side Sense Short Circuit Protection
- Programmable Closed-Loop Soft-Start
- TPS40060 Source Only/TPS40061 Source/Sink
PowerPAD is a trademark of Texas Instruments.
The TPS40060 and TPS40061 are high-voltage, wide input (10 V to 55 V) synchronous, step-down converters.
This family of devices offers design flexibility with a variety of user programmable functions, including; soft-start, UVLO, operating frequency, voltage feed-forward, high-side current limit, and loop compensation. These devices are also synchronizable to an external supply.
The TPS40060 and TPS40061 incorporate MOSFET gate drivers for external P-channel high-side and N-channel synchronous rectifier (SR) MOSFETs. Gate drive logic incorporates anti-cross conduction circuitry to prevent simultaneous high-side and synchronous rectifier conduction.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TPS40060 Wide Input Synchronous Buck Controller 数据表 (Rev. F) | 2013年 6月 3日 | |||
应用手册 | TPS4005x TPS4006x Effect of Programmable UVLO | 2004年 3月 25日 |
设计和开发
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TPS40060EVM — 10V 至 55V 输入、3.3V 输出、4A、宽输入范围 EVM
TPS40060EVM is a wide input range synchronous buck converter using the full input range ofthe TPS40060 to produce a regulated 3.3 V output at up to 4 A of load current. Using lossless RDS(on) current sense for short circuit protection and a high-side P-channel MOSFET simplifies the (...)
TPS40061 Unencrypted PSpice Average Model Package (Rev. A)
TPS40061 Unencrypted PSpice Transient Model Package (Rev. A)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
HTSSOP (PWP) | 16 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点