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TLV1570

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10 位、1.25MSPS ADC，具有 8 通道、DSP/(Q)SPI 接口、可编程内部基准电压、自动或软件断电、超低功耗

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TLV1570

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产品详情

Resolution (Bits) 10 Sample rate (max) (ksps) 1250 Number of input channels 8 Interface type SPI Architecture SAR Input type Single-ended Multichannel configuration Multiplexed Rating Catalog Reference mode External, Internal Input voltage range (max) (V) 5.5 Input voltage range (min) (V) 0 Operating temperature range (°C) -40 to 85 Power consumption (typ) (mW) 8 Analog supply (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 SNR (dB) 61 Digital supply (min) (V) 2.7 Digital supply (max) (V) 5.5
Resolution (Bits) 10 Sample rate (max) (ksps) 1250 Number of input channels 8 Interface type SPI Architecture SAR Input type Single-ended Multichannel configuration Multiplexed Rating Catalog Reference mode External, Internal Input voltage range (max) (V) 5.5 Input voltage range (min) (V) 0 Operating temperature range (°C) -40 to 85 Power consumption (typ) (mW) 8 Analog supply (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 SNR (dB) 61 Digital supply (min) (V) 2.7 Digital supply (max) (V) 5.5
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • Fast Throughput Rate: 1.25 MSPS at 5 V,
    625 KSPS at 3 V
  • Wide Analog Channel Input: 0 V to AVDD
  • Eight Analog Input Channels
  • Channel Auto-Scan
  • Differential Nonlinearity Error: < ±1 LSB
  • Integral Nonlinearity Error: < ±1 LSB
  • Signal-to-Noise and Distortion Ratio: 57 dB
  • Single 2.7-V to 5.5-V Supply Operation
  • Very Low Power: 40 mW at 5.5 V,
    8 mW at 2.7 V
  • Autopower-Down: 300 uA Max
  • Software Power Down: 10 uA Max
  • Glueless Serial Interface to TMS320 DSPs and (Q)SPI Compatible Microcontrollers
  • Programmable Internal Reference Voltage:
    3.8-V Reference for 5-V Operation,
    2.3-V Reference for 3-V Operation
  • Applications
    • Mass Storage and Hard Disk Drive
    • Automotive
    • Digital Servos
    • Process Control
    • General-Purpose DSP
    • Image Sensor Processing

SPI and QSPI are trademarks of Motorola, Inc.
  • Fast Throughput Rate: 1.25 MSPS at 5 V,
    625 KSPS at 3 V
  • Wide Analog Channel Input: 0 V to AVDD
  • Eight Analog Input Channels
  • Channel Auto-Scan
  • Differential Nonlinearity Error: < ±1 LSB
  • Integral Nonlinearity Error: < ±1 LSB
  • Signal-to-Noise and Distortion Ratio: 57 dB
  • Single 2.7-V to 5.5-V Supply Operation
  • Very Low Power: 40 mW at 5.5 V,
    8 mW at 2.7 V
  • Autopower-Down: 300 uA Max
  • Software Power Down: 10 uA Max
  • Glueless Serial Interface to TMS320 DSPs and (Q)SPI Compatible Microcontrollers
  • Programmable Internal Reference Voltage:
    3.8-V Reference for 5-V Operation,
    2.3-V Reference for 3-V Operation
  • Applications
    • Mass Storage and Hard Disk Drive
    • Automotive
    • Digital Servos
    • Process Control
    • General-Purpose DSP
    • Image Sensor Processing

SPI and QSPI are trademarks of Motorola, Inc.

The TLV1570 is a 10-bit data acquisition system that combines an 8-channel input multiplexer (MUX), a high-speed 10-bit ADC, an on-chip reference, and a high-speed serial interface. The device contains an on-chip control register allowing control of channel selection, conversion start, reference voltage levels, and power down via the serial port. The MUX is independently accessible, which allows the user to insert a signal conditioning circuit such as an antialiasing filter or an amplifier, if required, between the MUX and the ADC. Therefore one signal conditioning circuit can be used for all eight channels.

The TLV1570 operates from a single 2.7-V to 5.5-V power supply. The device accepts an analog input range from 0 V to AVDD and digitizes the input at a maximum 1.25 MSPS throughput rate. Power dissipation is only 8 mW with a 2.7-V supply or 40 mW with a 5.5-V supply. The device features an autopower-down mode that automatically powers down to 300 uA, 10 ns after a conversion is performed. With software power down enabled, the device is further powered down to only 10 uA.

The TLV1570 communicates with digital microprocessors via a simple 4- or 5-wire serial port that interfaces directly to Texas Instruments TMS320 DSPs, and SPITM and QSPITM compatible microcontrollers without using additional glue logic.

A very high throughput rate, a simple serial interface, and low power consumption make the TLV1570 an ideal choice for high-speed digital signal processing requiring multiple analog inputs.

The TLV1570 is a 10-bit data acquisition system that combines an 8-channel input multiplexer (MUX), a high-speed 10-bit ADC, an on-chip reference, and a high-speed serial interface. The device contains an on-chip control register allowing control of channel selection, conversion start, reference voltage levels, and power down via the serial port. The MUX is independently accessible, which allows the user to insert a signal conditioning circuit such as an antialiasing filter or an amplifier, if required, between the MUX and the ADC. Therefore one signal conditioning circuit can be used for all eight channels.

The TLV1570 operates from a single 2.7-V to 5.5-V power supply. The device accepts an analog input range from 0 V to AVDD and digitizes the input at a maximum 1.25 MSPS throughput rate. Power dissipation is only 8 mW with a 2.7-V supply or 40 mW with a 5.5-V supply. The device features an autopower-down mode that automatically powers down to 300 uA, 10 ns after a conversion is performed. With software power down enabled, the device is further powered down to only 10 uA.

The TLV1570 communicates with digital microprocessors via a simple 4- or 5-wire serial port that interfaces directly to Texas Instruments TMS320 DSPs, and SPITM and QSPITM compatible microcontrollers without using additional glue logic.

A very high throughput rate, a simple serial interface, and low power consumption make the TLV1570 an ideal choice for high-speed digital signal processing requiring multiple analog inputs.
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类型 标题 下载最新的英语版本 日期
* 数据表 2.7 V To 5.5 V 8-Channel 10-Bit 1.25-MSPS Serial Analog-to-Digital Converter 数据表 (Rev. B) 2000年 10月 13日

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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