PGA309
- Complete Bridge Sensor Conditioner
- Voltage Output: Ratiometric or Absolute
- Digital Cal: No Potentiometers/Sensor Trims
- Sensor Error Compensation
- Span, Offset, and Temperature Drifts
- Low Error, Time-Stable
- Sensor Linearization Circuitry
- Temperature Sense: Internal or External
- Calibration Lookup Table Logic
- Uses External EEPROM (SOT23-5)
- Over/Under-Scale Limiting
- Sensor Fault Detection
- +2.7V TO +5.5V Operation
- –40°C to +125°C Operation
- Small TSSOP-16 Package
- APPLICATIONS
- Bridge Sensors
- Remote 4-20mA Transmitters
- Strain, Load, and Weigh Scales
- Automotive Sensors
- Hardware Designer’s Kit (PGA309EVM)
- Temperature Eval of PGA309 + Sensor
- Full Programming of PGA309
- Sensor Compensation Analysis Tool
All other trademarks are the property of their respective owners.
The PGA309 is a programmable analog signal conditioner designed for bridge sensors. The analog signal path amplifies the sensor signal and provides digital calibration for zero, span, zero drift, span drift, and sensor linearization errors with applied stress (pressure, strain, etc.). The calibration is done via a One-Wire digital serial interface or through a Two-Wire industry-standard connection. The calibration parameters are stored in external nonvolatile memory (typically SOT23-5) to eliminate manual trimming and achieve long-term stability.
The all-analog signal path contains a 2x2 input multiplexer (mux), auto-zero programmable-gain instrumentation amplifier, linearization circuit, voltage reference, internal oscillator, control logic, and an output amplifier. Programmable level shifting compensates for sensor dc offsets.
The core of the PGA309 is the precision, low-drift, no 1/f noise Front-End PGA (Programmable Gain Amplifier). The overall gain of the Front-End PGA + Output Amplifier can be adjusted from 2.7V/V to 1152V/V. The polarity of the inputs can be switched through the input mux to accommodate sensors with unknown polarity output. The Fault Monitor circuit detects and signals sensor burnout, overload, and system fault conditions.
For detailed application information, see the PGA309 User's Guide (SBOU024) available for download at www.ti.com.
技术文档
设计和开发
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MULTI-CAL-SYSTEM — Multi-Cal-System 基础入门套件
Multi-Cal-System 是 EVM 和配件系统,可用于校准多个 PGA308 传感器模块。Multi-Cal-System 可配置为同时校准 8 至 64 个 PGA308。Multi-Cal-System 的关键组件是 Multi-Cal-System 入门套件。此套件包含:
- (1) Multi-Cal-Master 板
- (2) Multi-Cal-Test 板
- (1) Multi-Cal-Interface 板
- (2) Multi-Cal-Interface 电缆
- (1) Multi-Cal-Power 电缆
其他所有必需组件:USB-DAQ 平台、软件光盘、壁挂电源、USB (...)
PGA309EVM-USB — PGA309 评估模块
PGA309EVM-USB 主要硬件由 2 块电路板、PGA309 测试板和 USB DAQ 平台组成。PGA309 测试板包含 PGA309、用于外部连接的端子台、用于器件配置的多个跳线设置以及支持电路。PGA309 测试板可在您进行原型设计前对您的设计进行全面测试。USB DAQ 平台包含一个具有内置 USB 接口的 8052 微处理器。此微处理器生成与 PGA309 进行通信所需的 1 线信号。USB DAQ 平台还包含 3V/5V 可编程线性稳压器、电源控制开关、通用数字 I/O、DAC 输出和 A/D 输入。该软件是基于 windows 的图形软件,它允许用户与 PGA309 (...)
SENSOREMULATOREVM — SensorEmulatorEVM 评估模块
The SensorEmulatorEVM provides a complete system for strain and temperature emulation of voltage-excited bridge sensors. The SensorEmulatorEVM uses rotary selector switches and potentiometers to emulate the operation of a voltage-excited Wheatstone resistive bridge sensor at discrete operating (...)
SBOC394 — PGA309EVM-USB Source Code
支持的产品和硬件
SBOC401 — Multi-Cal-PGA309 System Software
支持的产品和硬件
产品
可编程和可变增益放大器(PGA 和 VGA)
硬件开发
评估板
SBOC065 — Generate Simulated Values
支持的产品和硬件
产品
可编程和可变增益放大器(PGA 和 VGA)
硬件开发
评估板
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模拟仿真程序
TINA-TI 安装需要大约 500MB。直接安装,如果想卸载也很容易。我们相信您肯定会爱不释手。
TINA 是德州仪器 (TI) 专有的 DesignSoft 产品。该免费版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需获取可用 TINA-TI 模型的完整列表,请参阅:SpiceRack - 完整列表
需要 HSpice (...)
TIPD126 — Bridge sensor signal conditioner with current loop output and EMC protection reference design
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点