PGA305
- Analog Features
- Analog Front-End for Resistive Bridge Sensors
- Accommodates Sensor Sensitivities From 1 mV/V to 135 mV/V
- On-Chip Temperature Sensor
- Programmable Gain
- 24-Bit Sigma-Delta Analog-to-Digital Converter for Signal Channel
- 24-Bit Sigma-Delta Analog-to-Digital Converter for Temperature Channel
- 14-Bit Output DAC
- Digital Features
- < 0.1% FSO Accuracy Across Temperature
- System Response Time < 220 µs
- Third-Order Offset, Gain, and Nonlinearity Temperature Compensation
- Diagnostic Functions
- Integrated EEPROM for Device Operation, Calibration Data and User Data
- Peripheral Features
- I2C interface for Data Reading and Device Configuration
- One-Wire Interface Enables Communication Through the Power Supply Pin Without Using Additional Lines
- 4-mA to 20-mA Current Loop Interface
- Ratiometric and Absolute Voltage Output
- Power Management Control
- Analog Low-Voltage Detect
- General Features
- Industrial Temperature Range: –40°C to 150°C
- Power Supply:
- On-Chip Power Management Accepts Wide Power-Supply Voltage From 3.3 V to 30 V
- Integrated Reverse-Protection Circuit
The PGA305 device supplies an interface for piezoresistive and strain-gauge pressure-sense elements. The device is a full system-on-chip (SoC) solution that includes programmable analog front end (AFE), ADC, and digital signal processing that enable direct connection to the sense element. The PGA305 device also includes integrated voltage regulators and an oscillator to minimize the number of external components. The PGA305 device can employ third-order temperature and nonlinearity compensation to achieve high accuracy. The device can also use the integrated I2C interface or the one-wire serial interface (OWI) to achieve external communication and simplify the system calibration process. An Integrated DAC supports absolute-voltage, ratiometric-voltage, and 4-mA to 20-mA current-loop outputs.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | PGA305 Signal Conditioner and Transmitter for Pressure Sensors 数据表 | PDF | HTML | 2017年 8月 29日 | ||
EVM 用户指南 | PGAxxxEVM-034 User’s Guide (Rev. B) | 2018年 8月 1日 | ||||
应用简报 | PGA900, PGA300 and PGA305 Use Case for HVAC Applications | 2017年 5月 2日 | ||||
应用简报 | PGA900, PGA300 and PGA305 Use Case for the Pressure Transmitter Applications | 2017年 5月 2日 | ||||
应用简报 | PGA900, PGA300 and PGA305 Use Case for Weight Scale (Load Cell) Applications | 2017年 5月 1日 | ||||
应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
VQFN (RHH) | 36 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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