主页 接口 I2C & I3C ICs I2C 通用 I/O (GPIO)
主页
接口
I2C & I3C ICs
I2C 通用 I/O (GPIO)

LM8335

正在供货

具有 MIPI RFFE 主机接口的 通用输出扩展器

立即订购
数据表

LM8335

正在供货
数据表 立即订购

产品详情

Number of I/Os 8 Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Addresses 2 Rating Catalog Frequency (max) (MHz) 26 Operating temperature range (°C) -30 to 85
Number of I/Os 8 Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Addresses 2 Rating Catalog Frequency (max) (MHz) 26 Operating temperature range (°C) -30 to 85
DSBGA (YZR) 16 5.0625 mm² 2.25 x 2.25
  • MIPI RFFE Interface Version 1.10 Compliant
  • Supports Output Expansion
  • Host Interface Address Select Pin:
    • ADR=GND, USID[3:0]=0001
    • ADR=VDD, USID[3:0]=1001
  • Pin-Configurable Initial State: VIO
    • CFG=GND, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Unmasked
    • CFG=VDD, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Masked
  • Three Sources for Chip Reset:
    • VIO Input Pin
    • POR
    • Software-Commanded Reset

Key Specifications

  • 1.8 ± 0.15V MIPI RFFE Operation (VIO)
  • 1.8 ± 0.15V Core Supply (VDD)
  • 1.65 to 3.6V GPO Supply (VDDIO)
  • Low Standby and Active Current
  • On-Chip Power-On Reset (POR)
  • −30 to +85°C Ambient Temperature Range
  • 16-Bump DSBGA Package
    • 1.965 mm x 1.965 mm x 0.6 mm, 0.5 mm Pitch (Nominal)

All trademarks are the property of their respective owners.

  • MIPI RFFE Interface Version 1.10 Compliant
  • Supports Output Expansion
  • Host Interface Address Select Pin:
    • ADR=GND, USID[3:0]=0001
    • ADR=VDD, USID[3:0]=1001
  • Pin-Configurable Initial State: VIO
    • CFG=GND, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Unmasked
    • CFG=VDD, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Masked
  • Three Sources for Chip Reset:
    • VIO Input Pin
    • POR
    • Software-Commanded Reset

Key Specifications

  • 1.8 ± 0.15V MIPI RFFE Operation (VIO)
  • 1.8 ± 0.15V Core Supply (VDD)
  • 1.65 to 3.6V GPO Supply (VDDIO)
  • Low Standby and Active Current
  • On-Chip Power-On Reset (POR)
  • −30 to +85°C Ambient Temperature Range
  • 16-Bump DSBGA Package
    • 1.965 mm x 1.965 mm x 0.6 mm, 0.5 mm Pitch (Nominal)

All trademarks are the property of their respective owners.

The LM8335 General Purpose Output Expander is a dedicated device to provide flexible and general purpose, host programmable output expansion functions. This device communicates with a host processor through a MIPI® RFFE Interface (Mobile Industry Processor Interface RF Front-End).

Eight general purpose outputs (GPO) can be configured by the host controller as drive high/low/high-z. Weak pull-ups (PU) or weak pull-downs (PD) can be enabled.

Upon power-on, the LM8335 default configuration is for all GPO to be set based on the state of the CFG pin.

After startup, any changes to the default configuration must be sent from the host via the MIPI RFFE host interface..

The LM8335 is available in a 16-bump lead-free DSBGA package of size 1.965 mm x 1.965 mm x 0.6 mm (0.5 mm pitch).

The LM8335 General Purpose Output Expander is a dedicated device to provide flexible and general purpose, host programmable output expansion functions. This device communicates with a host processor through a MIPI® RFFE Interface (Mobile Industry Processor Interface RF Front-End).

Eight general purpose outputs (GPO) can be configured by the host controller as drive high/low/high-z. Weak pull-ups (PU) or weak pull-downs (PD) can be enabled.

Upon power-on, the LM8335 default configuration is for all GPO to be set based on the state of the CFG pin.

After startup, any changes to the default configuration must be sent from the host via the MIPI RFFE host interface..

The LM8335 is available in a 16-bump lead-free DSBGA package of size 1.965 mm x 1.965 mm x 0.6 mm (0.5 mm pitch).
filter 查找其他 I2C 通用 I/O (GPIO)
下载

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 1
类型 标题 下载最新的英语版本 日期
* 数据表 LM8335 General-Purpose Output Expander with MIPI RFFE Host Interface 数据表 (Rev. B) 2013年 5月 2日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训