产品详情

Number of full bridges 1 Vs (min) (V) 4.5 Vs ABS (max) (V) 40 Peak output current (A) 10 RDS(ON) (HS + LS) (mΩ) 150 Sleep current (µA) 15 Control mode Independent 1/2-Bridge, PH/EN, PWM Control interface Hardware (GPIO), SPI Features Current sense Amplifier, Integrated Current Sensing, Open-Load Detection Rating Catalog Operating temperature range (°C) -40 to 125
Number of full bridges 1 Vs (min) (V) 4.5 Vs ABS (max) (V) 40 Peak output current (A) 10 RDS(ON) (HS + LS) (mΩ) 150 Sleep current (µA) 15 Control mode Independent 1/2-Bridge, PH/EN, PWM Control interface Hardware (GPIO), SPI Features Current sense Amplifier, Integrated Current Sensing, Open-Load Detection Rating Catalog Operating temperature range (°C) -40 to 125
HTSSOP (PWP) 24 49.92 mm² 7.8 x 6.4
  • H-Bridge Motor Driver
    • Drives One DC Motor, One Winding of a Stepper Motor, or Solenoid Loads
  • 4.5-V to 38-V Operating Voltage Range
  • 10-A Peak Current Drive
  • Low HS + LS RDS(ON)
    • 150 mΩ at TJ = 25°C, 13.5 V
    • 250 mΩ at TJ = 150°C, 13.5 V
  • Current Mirror for Output Current Sensing
  • Configurable Control Interface
    • PH/EN
    • PWM (IN1/IN2)
    • Independent Half-Bridge Control
  • Supports 1.8-V, 3.3-V, 5-V Logic Inputs
  • SPI or Hardware Interface Options
  • Low-Power Sleep Mode (10 µA)
  • Small Package and Footprint
    • 24 HTSSOP PowerPAD™ IC Package
  • Protection Features
    • VM Undervoltage Lockout (UVLO)
    • Charge Pump Undervoltage (CPUV)
    • Overcurrent Protection (OCP)
    • Output short to battery and short to ground protection
    • Open Load Detection
    • Thermal Shutdown (TSD)
    • Fault Condition Output (nFAULT / SPI)
  • H-Bridge Motor Driver
    • Drives One DC Motor, One Winding of a Stepper Motor, or Solenoid Loads
  • 4.5-V to 38-V Operating Voltage Range
  • 10-A Peak Current Drive
  • Low HS + LS RDS(ON)
    • 150 mΩ at TJ = 25°C, 13.5 V
    • 250 mΩ at TJ = 150°C, 13.5 V
  • Current Mirror for Output Current Sensing
  • Configurable Control Interface
    • PH/EN
    • PWM (IN1/IN2)
    • Independent Half-Bridge Control
  • Supports 1.8-V, 3.3-V, 5-V Logic Inputs
  • SPI or Hardware Interface Options
  • Low-Power Sleep Mode (10 µA)
  • Small Package and Footprint
    • 24 HTSSOP PowerPAD™ IC Package
  • Protection Features
    • VM Undervoltage Lockout (UVLO)
    • Charge Pump Undervoltage (CPUV)
    • Overcurrent Protection (OCP)
    • Output short to battery and short to ground protection
    • Open Load Detection
    • Thermal Shutdown (TSD)
    • Fault Condition Output (nFAULT / SPI)

The DRV8873 device is an integrated driver IC for driving a brushed DC motor in industrial applications. Two logic inputs control the H-bridge driver, which consists of four N-channel MOSFETs that drive motors bi-directionally with up to 10-A peak current. The device operates from a single power supply and supports a wide input supply range from 4.5 V to 38 V.

A PH/EN or PWM interface allows simple interfacing to controller circuits. Alternatively, independent half-bridge control is available to drive two solenoid loads.

A current mirror allows the controller to monitor the load current. This mirror approximates the current through the high-side FETs, and does not require a high-power resistor for sensing the current.

A low-power sleep mode is provided to achieve very-low quiescent current draw by shutting down much of the internal circuitry. Internal protection functions are provided for undervoltage lockout, charge pump faults, overcurrent protection, short-circuit protection, open-load detection, and overtemperature. Fault conditions are indicated on an nFAULT pin and through the SPI registers.

The DRV8873 device is an integrated driver IC for driving a brushed DC motor in industrial applications. Two logic inputs control the H-bridge driver, which consists of four N-channel MOSFETs that drive motors bi-directionally with up to 10-A peak current. The device operates from a single power supply and supports a wide input supply range from 4.5 V to 38 V.

A PH/EN or PWM interface allows simple interfacing to controller circuits. Alternatively, independent half-bridge control is available to drive two solenoid loads.

A current mirror allows the controller to monitor the load current. This mirror approximates the current through the high-side FETs, and does not require a high-power resistor for sensing the current.

A low-power sleep mode is provided to achieve very-low quiescent current draw by shutting down much of the internal circuitry. Internal protection functions are provided for undervoltage lockout, charge pump faults, overcurrent protection, short-circuit protection, open-load detection, and overtemperature. Fault conditions are indicated on an nFAULT pin and through the SPI registers.

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类型 标题 下载最新的英语版本 日期
* 数据表 DRV8873 H-Bridge Motor Driver 数据表 PDF | HTML 2018年 6月 11日
证书 DRV8873HEVM EU Declaration of Conformity (DoC) 2023年 7月 12日
证书 DRV8873SEVM EU Declaration of Conformity (DoC) 2023年 7月 11日
应用简报 集成电流感测的优势 (Rev. B) PDF | HTML 英语版 (Rev.B) PDF | HTML 2022年 10月 12日
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应用简报 Small Motors in Large Appliances 2018年 7月 20日
应用手册 PowerPAD™ Thermally Enhanced Package (Rev. H) 2018年 7月 6日
应用手册 所选封装材料的热学和电学性质 2008年 10月 16日
应用简报 PowerPAD® 轻松实现 (Rev. B) 2004年 5月 12日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

DRV8873HEVM — 具有硬件接口和集成式电流检测功能的 10A H 桥电机驱动器评估模块

DRV8873 是一款适用于工业和汽车应用的集成驱动器。该器件具有 10A 峰值电流能力和 4.5V 至 38V 的电压范围,可支持多种应用。PH/EN 或 PWM 接口允许轻松连接到控制器电路,同时还允许独立的半桥控制,以驱动两个螺线管负载。

电流镜接近于流经高侧 FET 的电流,并且不需要感应电阻器。

提供了低功耗睡眠模式,以通过关断多个内部电路实现极低的静态电流消耗。

借助 nFAULT 引脚上显示的故障状况并通过 SPI 寄存器,针对欠压锁定、电荷泵故障、过流保护、短路保护和过热等情况提供内部保护功能。

用户指南: PDF
TI.com 上无现货
评估板

DRV8873SEVM — 具有硬件接口和集成式电流检测功能的 10A H 桥电机驱动器评估模块

DRV8873 是一款适用于工业和汽车应用的集成驱动器。该器件具有 10A 峰值电流能力和 4.5V 至 38V 的电压范围,可支持多种应用。

PH/EN 或 PWM 接口允许轻松连接到控制器电路,同时还允许独立的半桥控制,以驱动两个螺线管负载。电流镜接近于流经高侧 FET 的电流,并且不需要感应电阻器。

提供了低功耗睡眠模式,以通过关断多个内部电路实现极低的静态电流消耗。

借助 nFAULT 引脚上显示的故障状况并通过 SPI 寄存器,针对欠压锁定、电荷泵故障、过流保护、短路保护和过热等情况提供内部保护功能。

用户指南: PDF
TI.com 上无现货
封装 引脚 CAD 符号、封装和 3D 模型
HTSSOP (PWP) 24 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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