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微控制器 (MCU) 和处理器
基于 Arm 的处理器

DM3730

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数字媒体处理器

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用户指南
勘误

DM3730

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数据表 立即订购

产品详情

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging
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TI 仅提供有限的设计支持

该产品对现有工程提供的 TI 设计支持有限。如可用，您将在产品文件夹中找到相关的配套资料、软件和工具。对于使用该产品的现有设计，您可以在 TI E2ETM 支持论坛中申请支持，但针对该产品提供的支持有限。

技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 DM3730、DM3725 数字媒体处理器 数据表 (Rev. D) 2011年 4月 11日
* 勘误表 DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014年 2月 13日
* 用户指南 AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012年 9月 24日
应用手册 OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 2019年 3月 20日
技术文章 Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 2016年 4月 13日
技术文章 Spring has sprung. A sale has sprung. PDF | HTML 2016年 4月 4日
应用手册 Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015年 8月 13日
技术文章 Selecting the right processor: WiLink 8 plug and play platforms PDF | HTML 2015年 6月 26日
应用手册 PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013年 11月 1日
用户指南 Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012年 9月 10日
更多文献资料 DM37x Design Network Partners 2012年 6月 5日
应用手册 TI OMAP4430 POP SMT Design Guideline (Rev. C) 2011年 11月 3日
应用手册 Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
应用手册 PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011年 6月 15日
产品概述 DM3730 Product Bulletin 2010年 9月 7日
应用手册 PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010年 6月 23日
应用手册 PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010年 6月 23日
应用手册 AM/DM37x Power Estimation Spreadsheet 2010年 6月 7日
应用手册 AM/DM37x Overview 2010年 6月 3日
应用手册 AM3715/03 Memory Subsystem 2010年 6月 3日
应用手册 AM37x CUS Routing Guidelines 2010年 6月 3日
应用手册 Setting up AM37x SDRC Registers 2010年 6月 3日
用户指南 Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 2005年 5月 23日
应用手册 AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 2004年 5月 1日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

软件开发套件 (SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

支持的产品和硬件

支持的产品和硬件

产品
基于 Arm 的处理器
DM3725 — 数字媒体处理器 DM3730 — 数字媒体处理器
下载选项
软件开发套件 (SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

支持的产品和硬件

支持的产品和硬件

产品
基于 Arm 的处理器
DM3725 — 数字媒体处理器 DM3730 — 数字媒体处理器
下载选项
软件开发套件 (SDK)

LINUXDVSDK-DM37X — 用于 DM3730/3725 数字媒体处理器的 Linux 数字视频软件开发套件 (DVSDK)

用于 DaVinci™ 处理器的 Linux 数字视频软件开发套件 (DVSDK) 可向开发者提供所需的一切功能，助其评估和开始开发 DM37x Cortex™-A8 DSP+ARM® 微处理器。使用附带的基于图形用户界面 (GUI) 的 Matrix 应用程序启动器，即可轻松启用演示、基准和应用。此外，开发者还能轻松开发应用，并将其添加到 Matrix 应用程序启动器。 DVSDK 还包括 DSP 加速音频视频编解码器，以及可轻松利用 DSP 进行其它信号处理任务的工具。

此版本是 Linux DVSDK 4.x 版的正式 (GA) 版。所支持的平台包括 (...)

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驱动程序或库

TELECOMLIB — 用于 TMS320C64x+ 和 TMS320C55x 处理器的电信和媒体库 - FAXLIB、VoLIB 和 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
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IDE、配置、编译器或调试器

CCSTUDIO — Code Composer Studio 集成式开发环境 (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

支持的产品和硬件

支持的产品和硬件

此设计资源支持这些类别中的大部分产品。

查看产品详情页，验证是否能提供支持。
启动 下载选项
软件编程工具

FLASHTOOL — 用于 AM35x、AM37x、DM37x 和 OMAP35x 器件的 FlashTool

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

支持的产品和硬件

支持的产品和硬件

产品
基于 Arm 的处理器
AM3505 — Sitara 处理器: Arm Cortex-A8、视频前端 AM3517 — Sitara 处理器：Arm Cortex-A8、3D 图形、视频前端 AM3703 — Sitara 处理器：Arm Cortex-A8、摄像机 AM3715 — Sitara 处理器: Arm Cortex-A8、3D 图形、摄像机 DM3725 — 数字媒体处理器 DM3730 — 数字媒体处理器 OMAP3503 — Sitara 处理器：Arm Cortex-A8、LPDDR OMAP3515 — Sitara 处理器：Arm Cortex-A8、3D 图形、LPDDR OMAP3525 — 应用处理器 OMAP3530 — 应用处理器
下载选项
仿真模型

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
下载
仿真模型

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
下载
仿真模型

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
下载
仿真模型

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
下载
仿真模型

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
下载
仿真模型

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
下载
参考设计

TIDA-00408 — 面向楼宇自动化和医疗应用的压电式反馈电容触摸显示器参考设计

采用触摸反馈的 TIDA-00408 触摸显示屏参考设计展示了用于恒温器、自动化建立、工厂自动化、销售点和汽车应用的触摸技术。当用户与屏上用户界面进行交互时，触摸屏会提供触摸反馈。该参考设计包含一块 7” 电容式触摸显示屏、一个 DRV2667 Piezo 触摸驱动器和两个 Piezo 传动器。
设计指南: PDF
原理图: PDF
封装 引脚 CAD 符号、封装和 3D 模型
FCCSP (CBC) 515 Ultra Librarian
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。

支持和培训

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