ZHCSEH3B December   2015  – September 2018 TAS5411-Q1

PRODUCTION DATA.  

1. 1 特性
2. 2 应用
3. 3 说明
   1.     Device Images
      1.      简化框图
      2.      效率
4. 4 修订历史记录
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
   1.     Pin Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 Timing Requirements for I2C Interface Signals
   7. 7.7 Typical Characteristics
8. 8 Parameter Measurement Information
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Analog Audio Input and Preamplifier
      2. 9.3.2 Pulse-Width Modulator (PWM)
      3. 9.3.3 Gate Drive
      4. 9.3.4 Power FETs
      5. 9.3.5 Load Diagnostics
         1. 9.3.5.1 Load Diagnostics Sequence
         2. 9.3.5.2 Faults During Load Diagnostics
      6. 9.3.6 Protection and Monitoring
      7. 9.3.7 I2C Serial Communication Bus
         1. 9.3.7.1 I2C Bus Protocol
         2. 9.3.7.2 Random Write
         3. 9.3.7.3 Random Read
         4. 9.3.7.4 Sequential Read
   4. 9.4 Device Functional Modes
      1. 9.4.1 Hardware Control Pins
      2. 9.4.2 EMI Considerations
      3. 9.4.3 Operating Modes and Faults
   5. 9.5 Register Maps
10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
          1. 10.2.1.1 Amplifier Output Filtering
          2. 10.2.1.2 Amplifier Output Snubbers
          3. 10.2.1.3 Bootstrap Capacitors
          4. 10.2.1.4 Analog Audio Input Filter
       2. 10.2.2 Detailed Design Procedure
          1. 10.2.2.1 Unused Pin Connections
             1. 10.2.2.1.1 MUTE Pin
             2. 10.2.2.1.2 STANDBY Pin
             3. 10.2.2.1.3 I2C Pins (SDA and SCL)
             4. 10.2.2.1.4 Terminating Unused Outputs
             5. 10.2.2.1.5 Using a Single-Ended Audio Input
       3. 10.2.3 Application Curves
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
       1. 12.2.1 Top Layer
       2. 12.2.2 Second Layer – Signal Layer
       3. 12.2.3 Third Layer – Power Layer
       4. 12.2.4 Bottom Layer – Ground Layer
13. 13器件和文档支持
    1. 13.1 器件支持
       1. 13.1.1 第三方产品免责声明
    2. 13.2 文档支持
       1. 13.2.1 相关文档
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
14. 14机械、封装和可订购信息