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LVDS、M-LVDS 和 PECL IC

DS25BR150

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3.125Gbps LVDS 缓冲器

立即订购
数据表

DS25BR150

正在供货
数据表 立即订购

产品详情

Function Buffer Protocols CML, LVDS, LVPECL Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 3125 Input signal CML, LVDS, LVPECL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
Function Buffer Protocols CML, LVDS, LVPECL Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 3125 Input signal CML, LVDS, LVPECL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
WSON (NGQ) 8 9 mm² 3 x 3
  • DC - 3.125 Gbps Low Jitter, High Noise Immunity, Low Power Operation
  • On-Chip 100 Ω Input and Output Termination Minimizes Insertion and Return Losses, Reduces Component Count and Minimizes Board Space
  • 7 kV ESD on LVDS I/O Pins Protects Adjoining Components
  • Small 3 mm x 3 mm WSON-8 Space Saving Package

All trademarks are the property of their respective owners.

  • DC - 3.125 Gbps Low Jitter, High Noise Immunity, Low Power Operation
  • On-Chip 100 Ω Input and Output Termination Minimizes Insertion and Return Losses, Reduces Component Count and Minimizes Board Space
  • 7 kV ESD on LVDS I/O Pins Protects Adjoining Components
  • Small 3 mm x 3 mm WSON-8 Space Saving Package

All trademarks are the property of their respective owners.

The DS25BR150 is a single channel 3.125 Gbps LVDS buffer optimized for high-speed signal transmission over printed circuit boards and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity.

The DS25BR150 is a buffer/repeater with very low power consumption. Other LVDS devices with similar IO characteristics and with signal conditioning features include the following products. The DS25BR110 features four levels of equalization for use as an optimized receiver device, the DS25BR120 features four levels of pre-emphasis for use as an optimized driver device, and the DS25BR100 features both pre-emphasis and equalization for use as an optimized repeater device.

Wide input common mode range allows the receiver to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. The differential inputs and outputs are internally terminated with a 100Ω resistor to lower device input and output return losses, reduce component count, and further minimize board space.

The DS25BR150 is a single channel 3.125 Gbps LVDS buffer optimized for high-speed signal transmission over printed circuit boards and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity.

The DS25BR150 is a buffer/repeater with very low power consumption. Other LVDS devices with similar IO characteristics and with signal conditioning features include the following products. The DS25BR110 features four levels of equalization for use as an optimized receiver device, the DS25BR120 features four levels of pre-emphasis for use as an optimized driver device, and the DS25BR100 features both pre-emphasis and equalization for use as an optimized repeater device.

Wide input common mode range allows the receiver to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. The differential inputs and outputs are internally terminated with a 100Ω resistor to lower device input and output return losses, reduce component count, and further minimize board space.
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类型 标题 下载最新的英语版本 日期
* 数据表 DS25BR150 3.125 Gbps LVDS Buffer 数据表 (Rev. E) 2013年 4月 14日
用户指南 3.125 Gbps LVDS Buffer / Repeater (DS25BR150) Evaluation Kit User Guide 2012年 1月 25日
应用手册 Signal Integrity Eval of Bourns Lightning Protection Solutions w/HS Interfaces 2010年 1月 8日

设计和开发

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仿真模型

DS25BR150 IBIS Model

SNLM062.ZIP (10 KB) - IBIS Model
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用户指南: PDF
英语版 (Rev.A): PDF
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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  • 封装厂地点

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