主页 数据转换器 数模转换器 (DAC) 高速 DAC (> 10MSPS)
主页
数据转换器
数模转换器 (DAC)
高速 DAC (> 10MSPS)

DAC5662-EP

正在供货

12 位 200Msps 双通道数模转换器（增强型产品）

立即订购
数据表

DAC5662-EP

正在供货
数据表 立即订购

产品详情

Resolution (Bits) 12 Number of DAC channels 2 Interface type Parallel CMOS Sample/update rate (Msps) 200 Features Low Power Rating HiRel Enhanced Product Interpolation 1x Power consumption (typ) (mW) 330 SFDR (dB) 85 Architecture Current Source Operating temperature range (°C) -55 to 125 Reference type Ext
Resolution (Bits) 12 Number of DAC channels 2 Interface type Parallel CMOS Sample/update rate (Msps) 200 Features Low Power Rating HiRel Enhanced Product Interpolation 1x Power consumption (typ) (mW) 330 SFDR (dB) 85 Architecture Current Source Operating temperature range (°C) -55 to 125 Reference type Ext
TQFP (PFB) 48 81 mm² 9 x 9
  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • 12-Bit Dual Transmit Digital-to-Analog Converter (DAC)
  • 200-MSPS Update Rate
  • Single Supply: 3 V to 3.6 V
  • High Spurious-Free Dynamic Range (SFDR): 85 dBc at 5 MHz
  • High Third-Order Two-Tone Intermodulation (IMD3): 78 dBc at 15.1 and 16.1 MHz
  • WCDMA Adjacent Channel Leakage Ratio (ACLR): 70 dB at 30.72 MHz
  • Independent or Single Resistor Gain Control
  • Dual or Interleaved Data
  • On-Chip 1.2-V Reference
  • Low Power: 330 mW
  • Power-Down Mode: 15 mW
  • Package: 48-Pin Thin Quad Flat Pack (TQFP)
  • APPLICATIONS
    • Cellular Base Transceiver Station Transmit Channel
      • CDMA: W-CDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/UWC-136
    • Medical/Test Instrumentation
    • Arbitrary Waveform Generators (ARB)
    • Direct Digital Synthesis (DDS)
    • Cable Modem Termination System (CMTS)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • 12-Bit Dual Transmit Digital-to-Analog Converter (DAC)
  • 200-MSPS Update Rate
  • Single Supply: 3 V to 3.6 V
  • High Spurious-Free Dynamic Range (SFDR): 85 dBc at 5 MHz
  • High Third-Order Two-Tone Intermodulation (IMD3): 78 dBc at 15.1 and 16.1 MHz
  • WCDMA Adjacent Channel Leakage Ratio (ACLR): 70 dB at 30.72 MHz
  • Independent or Single Resistor Gain Control
  • Dual or Interleaved Data
  • On-Chip 1.2-V Reference
  • Low Power: 330 mW
  • Power-Down Mode: 15 mW
  • Package: 48-Pin Thin Quad Flat Pack (TQFP)
  • APPLICATIONS
    • Cellular Base Transceiver Station Transmit Channel
      • CDMA: W-CDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/UWC-136
    • Medical/Test Instrumentation
    • Arbitrary Waveform Generators (ARB)
    • Direct Digital Synthesis (DDS)
    • Cable Modem Termination System (CMTS)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The DAC5662 is a monolithic, dual-channel 12-bit, high-speed digital-to-analog converter (DAC) with on-chip voltage reference.

Operating with update rates of up to 200 MSPS, the DAC5662 offers exceptional dynamic performance, tight gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications.

Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog-output configurations. External resistors allow scaling the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.

The DAC5662 has two 12-bit parallel input ports with separate clocks and data latches. For flexibility, the DAC5662 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.

The DAC5662 has been specifically designed for a differential transformer coupled output with a 50- doubly terminated load. For a 20-mA full-scale output current a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2-dBm output power) are supported.

The DAC5662 is available in a 48-pin thin quad flat pack (TQFP). Pin compatibility between family members provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5662 is pin compatible to the DAC2902 and AD9765 dual DACs. The device is characterized for operation over the military temperature range of -55°C to 125°C.

The DAC5662 is a monolithic, dual-channel 12-bit, high-speed digital-to-analog converter (DAC) with on-chip voltage reference.

Operating with update rates of up to 200 MSPS, the DAC5662 offers exceptional dynamic performance, tight gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications.

Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog-output configurations. External resistors allow scaling the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.

The DAC5662 has two 12-bit parallel input ports with separate clocks and data latches. For flexibility, the DAC5662 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.

The DAC5662 has been specifically designed for a differential transformer coupled output with a 50- doubly terminated load. For a 20-mA full-scale output current a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2-dBm output power) are supported.

The DAC5662 is available in a 48-pin thin quad flat pack (TQFP). Pin compatibility between family members provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5662 is pin compatible to the DAC2902 and AD9765 dual DACs. The device is characterized for operation over the military temperature range of -55°C to 125°C.
filter 查找其他 高速 DAC (> 10MSPS)
下载 观看带字幕的视频 视频

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 6
类型 标题 下载最新的英语版本 日期
* 数据表 DAC5662-EP 数据表 (Rev. A) 2006年 10月 10日
* 辐射与可靠性报告 DAC5662MPFBREP Reliability Report 2016年 8月 16日
* VID DAC5662-EP VID V6206651 2016年 6月 21日
应用手册 High Speed, Digital-to-Analog Converters Basics (Rev. A) 2012年 10月 23日
应用手册 所选封装材料的热学和电学性质 2008年 10月 16日
应用手册 高速数据转换 英语版 2008年 10月 16日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

模拟工具

PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库，您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案，然后再进行布局和制造，可缩短产品上市时间并降低开发成本。

在 PSpice for TI 设计和仿真工具中，您可以搜索 TI (...)
发送申请
封装 引脚 CAD 符号、封装和 3D 模型
TQFP (PFB) 48 Ultra Librarian
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。

支持和培训

视频