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UC2706M

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具有 40V VDD 和双输入结构的军用级 1.5A/1.5A 双路栅极驱动器

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UC2706M

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产品详情

Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 1.5 Input supply voltage (min) (V) 5 Input supply voltage (max) (V) 40 Features Analog Shutdown with Latch, Inhibit Circuit, Thermal shutdown Operating temperature range (°C) -40 to 85 Rise time (ns) 40 Fall time (ns) 40 Propagation delay time (µs) 0.1 Input threshold TTL Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Military Driver configuration Dual
Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 1.5 Input supply voltage (min) (V) 5 Input supply voltage (max) (V) 40 Features Analog Shutdown with Latch, Inhibit Circuit, Thermal shutdown Operating temperature range (°C) -40 to 85 Rise time (ns) 40 Fall time (ns) 40 Propagation delay time (µs) 0.1 Input threshold TTL Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Military Driver configuration Dual
CDIP (J) 16 135.3552 mm² 19.56 x 6.92
  • Dual, 1.5A Totem Pole Outputs
  • 40nsec Rise and Fall into 1000pF
  • Parallel or Push-Pull Operation
  • Single-Ended to Push-Pull Conversion
  • High-Speed, Power MOSFET Compatible
  • Low Cross-Conduction Current Spike
  • Analog, Latched Shutdown
  • Internal Deadband Inhibit Circuit
  • Low Quiescent Current
  • 5 to 40V Operation
  • Thermal Shutdown Protection
  • 16-Pin Dual-In-Line Package
  • 20-Pin Surface Mount Package
  • Dual, 1.5A Totem Pole Outputs
  • 40nsec Rise and Fall into 1000pF
  • Parallel or Push-Pull Operation
  • Single-Ended to Push-Pull Conversion
  • High-Speed, Power MOSFET Compatible
  • Low Cross-Conduction Current Spike
  • Analog, Latched Shutdown
  • Internal Deadband Inhibit Circuit
  • Low Quiescent Current
  • 5 to 40V Operation
  • Thermal Shutdown Protection
  • 16-Pin Dual-In-Line Package
  • 20-Pin Surface Mount Package

The UC1706 family of output drivers are made with a high-speed Schottky process to interface between low-level control functions and high-power switching devices - particularly power MOSFET's. These devices implement three generalized functions as outlined below.

First: They accept a single-ended, low-current digital input of either polarity and process it to activate a pair of high-current, totem pole outputs which can source or sink up to 1.5A each.

Second: They provide an optional single-ended to push-pull conversion through the use of an internal flip-flop driven by double-pulse-suppression logic. With the flip-flop disabled, the outputs work in parallel for 3.0A capability.

Third: Protection functions are also included for pulse-by-pulse current limiting, automatic deadband control, and thermal shutdown.

These devices are available in a two-watt plastic "bat-wing" DIP for operation over a 0°C to 70°C temperature range and, with reduced power, in a hermetically sealed cerdip for -55°C to +125°C operation. Also available in surface mount Q and L packages.

The UC1706 family of output drivers are made with a high-speed Schottky process to interface between low-level control functions and high-power switching devices - particularly power MOSFET's. These devices implement three generalized functions as outlined below.

First: They accept a single-ended, low-current digital input of either polarity and process it to activate a pair of high-current, totem pole outputs which can source or sink up to 1.5A each.

Second: They provide an optional single-ended to push-pull conversion through the use of an internal flip-flop driven by double-pulse-suppression logic. With the flip-flop disabled, the outputs work in parallel for 3.0A capability.

Third: Protection functions are also included for pulse-by-pulse current limiting, automatic deadband control, and thermal shutdown.

These devices are available in a two-watt plastic "bat-wing" DIP for operation over a 0°C to 70°C temperature range and, with reduced power, in a hermetically sealed cerdip for -55°C to +125°C operation. Also available in surface mount Q and L packages.
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类型 标题 下载最新的英语版本 日期
* 数据表 Dual Output Driver 数据表 (Rev. A) 2001年 5月 2日

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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