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DAC70502 正在供货 双通道 1LSB INL 14 位 SPI 电压输出数模转换器 (DAC) 14-bit high precision device with internal reference and SON 2.5 mm by 2.5 mm package

产品详情

Resolution (bps) 14 Number of DAC channels 2 Interface type SPI Output type Buffered Voltage Output voltage range (V) 0 to 5.5 INL (max) (±LSB) 3 Settling time (µs) 7 Reference type Ext, Int Architecture String Rating Catalog Features Current source/sink DAC Sample/update rate (Msps) 0.1 Power consumption (typ) (mW) 0.5 Operating temperature range (°C) -40 to 125 Product type Precision DAC
Resolution (bps) 14 Number of DAC channels 2 Interface type SPI Output type Buffered Voltage Output voltage range (V) 0 to 5.5 INL (max) (±LSB) 3 Settling time (µs) 7 Reference type Ext, Int Architecture String Rating Catalog Features Current source/sink DAC Sample/update rate (Msps) 0.1 Power consumption (typ) (mW) 0.5 Operating temperature range (°C) -40 to 125 Product type Precision DAC
VSSOP (DGS) 10 14.7 mm² 3 x 4.9 WSON (DSC) 10 9 mm² 3 x 3
  • Relative Accuracy:
    • DAC756x (12-Bit): 0.3 LSB INL
    • DAC816x (14-Bit): 1 LSB INL
    • DAC856x (16-Bit): 4 LSB INL
  • Glitch Impulse: 0.1 nV-s
  • Bidirectional Reference: Input or 2.5-V Output
    • Output Disabled by Default
    • ±5-mV Initial Accuracy (Max)
    • 4-ppm°C Temperature Drift (Typ)
    • 10-ppm/°C Temperature Drift (Max)
    • 20-mA Sink and Source Capability
  • Power-On Reset to Zero Scale or Mid-Scale
  • Low-Power: 4 mW (Typ, 5-V AVDD, Including Internal Reference Current)
  • Wide Power-Supply Range: 2.7 V to 5.5 V
  • 50-MHz SPI With Schmitt-Triggered Inputs
  • LDAC and CLR Functions
  • Output Buffer With Rail-to-Rail Operation
  • Packages: WSON-10 (3 mm × 3 mm), VSSOP-10
  • Temperature Range: –40°C to 125°C

All trademarks are the property of their respective owners.

  • Relative Accuracy:
    • DAC756x (12-Bit): 0.3 LSB INL
    • DAC816x (14-Bit): 1 LSB INL
    • DAC856x (16-Bit): 4 LSB INL
  • Glitch Impulse: 0.1 nV-s
  • Bidirectional Reference: Input or 2.5-V Output
    • Output Disabled by Default
    • ±5-mV Initial Accuracy (Max)
    • 4-ppm°C Temperature Drift (Typ)
    • 10-ppm/°C Temperature Drift (Max)
    • 20-mA Sink and Source Capability
  • Power-On Reset to Zero Scale or Mid-Scale
  • Low-Power: 4 mW (Typ, 5-V AVDD, Including Internal Reference Current)
  • Wide Power-Supply Range: 2.7 V to 5.5 V
  • 50-MHz SPI With Schmitt-Triggered Inputs
  • LDAC and CLR Functions
  • Output Buffer With Rail-to-Rail Operation
  • Packages: WSON-10 (3 mm × 3 mm), VSSOP-10
  • Temperature Range: –40°C to 125°C

All trademarks are the property of their respective owners.

The DAC756x, DAC816x, and DAC856x devices are low-power, voltage-output, dual-channel, 16-, 14-, and 12-bit digital-to-analog converters (DACs), respectively. These devices include a 2.5-V, 4-ppm/°C internal reference, giving a full-scale output voltage range of 2.5 V or 5 V. The internal reference has an initial accuracy of ±5 mV and can source or sink up to 20 mA at the VREFIN/VREFOUT pin.

These devices are monotonic, providing excellent linearity and minimizing undesired code-to-code transient voltages (glitch). They use a versatile three-wire serial interface that operates at clock rates up to 50 MHz. The interface is compatible with standard SPI, QSPI, Microwire, and digital signal processor (DSP) interfaces. The DACxx62 devices incorporate a power-on-reset circuit that ensures the DAC output powers up and remains at zero scale until a valid code is written to the device, whereas the DACxx63 devices similarly power up at mid-scale. These devices contain a power-down feature that reduces current consumption to typically 550 nA at 5 V. The low power consumption, internal reference, and small footprint make these devices ideal for portable, battery-operated equipment.

The DACxx62 devices are drop-in and function-compatible with each other, as are the DACxx63 devices. The entire family is available in MSOP-10 and SON-10 packages.

The DAC756x, DAC816x, and DAC856x devices are low-power, voltage-output, dual-channel, 16-, 14-, and 12-bit digital-to-analog converters (DACs), respectively. These devices include a 2.5-V, 4-ppm/°C internal reference, giving a full-scale output voltage range of 2.5 V or 5 V. The internal reference has an initial accuracy of ±5 mV and can source or sink up to 20 mA at the VREFIN/VREFOUT pin.

These devices are monotonic, providing excellent linearity and minimizing undesired code-to-code transient voltages (glitch). They use a versatile three-wire serial interface that operates at clock rates up to 50 MHz. The interface is compatible with standard SPI, QSPI, Microwire, and digital signal processor (DSP) interfaces. The DACxx62 devices incorporate a power-on-reset circuit that ensures the DAC output powers up and remains at zero scale until a valid code is written to the device, whereas the DACxx63 devices similarly power up at mid-scale. These devices contain a power-down feature that reduces current consumption to typically 550 nA at 5 V. The low power consumption, internal reference, and small footprint make these devices ideal for portable, battery-operated equipment.

The DACxx62 devices are drop-in and function-compatible with each other, as are the DACxx63 devices. The entire family is available in MSOP-10 and SON-10 packages.

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技术文档

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* 数据表 DACxx6x Dual 16-, 14-, 12-Bit, Low-Power, Buffered, Voltage-Output DACs With 2.5-V, 4-PPM/°C Internal Reference 数据表 (Rev. E) PDF | HTML 2015年 6月 12日
应用手册 所选封装材料的热学和电学性质 2008年 10月 16日
应用手册 高速数据转换 英语版 2008年 10月 16日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

仿真模型

DAC8162 IBIS Model

SBAM051.ZIP (39 KB) - IBIS Model
仿真模型

DAC8162 IBIS Model (Rev. A)

SBAM051A.ZIP (11 KB) - IBIS Model
计算工具

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借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。

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TINA-TI 安装需要大约 500MB。直接安装,如果想卸载也很容易。我们相信您肯定会爱不释手。

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如需获取可用 TINA-TI 模型的完整列表,请参阅:SpiceRack - 完整列表 

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用户指南: PDF
英语版 (Rev.A): PDF
封装 引脚 CAD 符号、封装和 3D 模型
VSSOP (DGS) 10 Ultra Librarian
WSON (DSC) 10 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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